Sony Pcm-d50 Software Mac Rating: 5,7/10 1556 reviews
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Nov 29, 2017 SONY PCM-D50 $599.99 ECM-957PRO $449.95. Pros: Rugged construction. Virtually noiseless recording. Switchable mic positions. Built-in 4 GB Flash memory and Memory Stick Pro expansion slot. Connects to Mac or PC via USB 2. Cons: Very wind sensitive. Duo app login issues mac affee dat file free. All Downloads Manuals Questions & Answers. Important Information. Popular Topics. Stay informed about news, software/firmware updates and more! Unfortunately, there currently are no downloads for this product. Support by Sony (Mobile App).
The Sony unit has a headphone output and a Line Out (Optical). Which one of these would give me the best sound output if I were to plug a cable from one of those outputs to the Mic port on my HG10?
Does the HG10 even have an optical audio input?
Would It be better to record the sound just onto the Sony unit and sync it up with the video one Im editing?
You'll need to convert the files from the PCM-D50 since it records at 44.1khz. Do the conversion BEFORE you import the audio into your FCP project.
-DH
Read Sony PCM-D50 Service Manual online
Sony Corporation
PCM-D50
LINEAR PCM RECORDER
2010I04-1
2010.09
Canadian Model
UK Model
Chinese Model
Recording media
Built-in flash memory 4 GB, “Memory Stick” (not supplied), Linear PCM
Stereo recording
Stereo recording
Maximum recordable time (Approximate)
The total maximum recordable time (approximate) of all the folders is as follows.
The total maximum recordable time (approximate) of all the folders is as follows.
Sampling frequency/
quantifying bit number
quantifying bit number
22.05 kHz 16 bit
44.10 kHz 16 bit
44.10 kHz 24 bit
48.00 kHz 16 bit
48.00 kHz 24 bit
96.00 kHz 16 bit
96.00 kHz 24 bit
“Memory Stick PRO-HG Duo”
Maximum recordable time *
2 GB
22.05 kHz 16 bit
6 hrs 25 min.
44.10 kHz 16 bit
3 hrs 10 min.
44.10 kHz 24 bit
2 hrs 5 min.
48.00 kHz 16 bit
2 hrs 55 min.
48.00 kHz 24 bit
1 hr 55 min.
96.00 kHz 16 bit
1 hr 25 min.
96.00 kHz 24 bit
55 min.
* The maximum recordable time varies depending on recording conditions.
Capacity
Part of the memory capacity is allocated to data management.
Actual usable capacity: Approx. 3.83 GB (4,116,611,072 bytes)
Actual usable capacity: Approx. 3.83 GB (4,116,611,072 bytes)
2
Quantization: 16-bit linear, 24-bit
linear
Frequency range (Input from the LINE
IN (OPT) jack when recording/
playing back) (0 to –2 dB):
Fs 22.05 kHz: 20 to 10,000 Hz
Fs 44.10 kHz: 20 to 20,000 Hz
Fs 48.00 kHz: 20 to 22,000 Hz
Fs 96.00 kHz: 20 to 40,000 Hz
linear
Frequency range (Input from the LINE
IN (OPT) jack when recording/
playing back) (0 to –2 dB):
Fs 22.05 kHz: 20 to 10,000 Hz
Fs 44.10 kHz: 20 to 20,000 Hz
Fs 48.00 kHz: 20 to 22,000 Hz
Fs 96.00 kHz: 20 to 40,000 Hz
MPEG Ver. 1 Layer 3:
32, 44.1, 48 kHz
32 to 320 kbps, VBR
MPEG Ver. 2 Layer 3:
16, 22.05, 24 kHz
32 to 160 kbps, VBR
32, 44.1, 48 kHz
32 to 320 kbps, VBR
MPEG Ver. 2 Layer 3:
16, 22.05, 24 kHz
32 to 160 kbps, VBR
Signal-to-noise ratio (S/N) (Input from the
LINE IN (OPT) jack when recording/playing
back)
LINE IN (OPT) jack when recording/playing
back)
Total harmonic distortion (Input from the
LINE IN (OPT) jack)
LINE IN (OPT) jack)
22.05 kHz 16 bit, 44.10 kHz 16/24 bit:
0.01% or below (1 kHz, 22 kHz LPF)
48.00 kHz 16/24 bit, 96.00 kHz
16/24 bit: 0.01% or below
(1 kHz, 22 kHz LPF)
0.01% or below (1 kHz, 22 kHz LPF)
48.00 kHz 16/24 bit, 96.00 kHz
16/24 bit: 0.01% or below
(1 kHz, 22 kHz LPF)
Below measurable limit (less than
±0.001% W.PEAK)
±0.001% W.PEAK)
m (microphone) jack (stereo mini jack)
:
Rated input level: 2.5mV
Minimum input level: 0.7mV
Minimum input level: 0.7mV
(headphone) jack (stereo mini jack)
Rated output level: 400mV
Maximum output level:
25mW + 25mW or more
Load impedance: 16
Maximum output level:
25mW + 25mW or more
Load impedance: 16
LINE IN (OPT) jack
:
Rated input level: 2.0V
Minimum input level: 450mV
Input level: –24.5 to –14.5 dBm
(for optical digital input)
Absorption wavelength:
630 to 690 nm
(for optical digital input)
Minimum input level: 450mV
Input level: –24.5 to –14.5 dBm
(for optical digital input)
Absorption wavelength:
630 to 690 nm
(for optical digital input)
Output impedance:
1 k
1 k
220
Rated output level: 1.7V
Load impedance: 22k
Load impedance: 22k
Output level: –21 to –15 dBm
(for optical digital output)
Emission wavelength: 630 to 690 nm
(for optical digital output)
(for optical digital output)
Emission wavelength: 630 to 690 nm
(for optical digital output)
Storage Class)
General
DC IN 6V
Four LR6 (size AA) alkaline batteries
(supplied)
Four nickel metal hydride
rechargeable batteries NH-AA (not
supplied)
Four LR6 (size AA) alkaline batteries
(supplied)
Four nickel metal hydride
rechargeable batteries NH-AA (not
supplied)
0.75 W
Approx. 72.0 × 154.5 × 32.7 mm
(2
(2
/
× 6
/
× 1
/
inches) (w/h/d)
Mass 365 g (12.88 oz) (including batteries)
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Design and specifications are subject to change
without notice.
without notice.
3
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
• Keep the temperature of soldering iron around 270 °C during
• Do not touch the soldering iron on the same conductor of the
• Be careful not to apply force on the conductor when soldering
Notes on chip component replacement
• Notice that the minus side of a tantalum capacitor may be dam-
SAFETY-RELATED COMPONET WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COM- POSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COM- POSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
Danger of explosion if battery is incorrectly replaced.
4
.................................
2. DISASSEMBLY
2-1. Panel (Front) Assy ............................. 11
2-2. Ornamental Belt (Upper) Assy .................... 11
2-3. Backlight Board ............................... 12
2-4. Power Board .................................. 12
2-5. REC VOL Assy, HP VOL Assy ................... 13
2-6. DA Board .................................... 13
2-7. AD Board, MIC001, MIC002 ..................... 14
2-8. System Board ................................. 14
TEST MODE
.............................. 15
4-1. Block Diagram - AD Section - .................... 20
4-2. Block Diagram - DA Section - .................... 21
4-3. Block Diagram - Power Section - ................. 22
4-4. Printed Wiring Board - AD Section (1/2) - .......... 23
4-5. Printed Wiring Board - AD Section (2/2) - .......... 24
4-6. Schematic Diagram - AD Section (1/3) - ............ 25
4-7. Schematic Diagram - AD Section (2/3) - ............ 26
4-8. Schematic Diagram - AD Section (3/3) - ............ 27
4-9. Printed Wiring Board - DA Section (1/2) - .......... 28
4-10. Printed Wiring Board - DA Section (2/2) - .......... 29
- Backlight/HP Volume/REC VOL Flexible Section - .. 30
4-12. Schematic Diagram - DA Section - ................ 31
Sony Pcm-d50 Manual
4-13. Printed Wiring Board - System Section (1/2) - ....... 32
4-14. Printed Wiring Board - System Section (2/2) - ....... 33
4-15. Schematic Diagram - System Section (1/5) - ......... 34
4-16. Schematic Diagram - System Section (2/5) - ......... 35
4-17. Schematic Diagram - System Section (3/5) - ......... 36
4-18. Schematic Diagram - System Section (4/5) - ......... 37
4-19. Schematic Diagram - System Section (5/5) - ......... 38
Sony Pcm D50 Memory Card
4-20. Printed Wiring Board - Power Section (1/2) - ........ 39
4-21. Printed Wiring Board - Power Section (2/2) - ........ 40
4-22. Schematic Diagram - Power Section (1/4) - ......... 41
4-23. Schematic Diagram - Power Section (2/4) - ......... 42
4-24. Schematic Diagram - Power Section (3/4) - ......... 43
4-25. Schematic Diagram - Power Section (4/4) - ......... 44
EXPLODED VIEWS
5-1. Front Panel Section ............................. 64
5-2. LCD Section .................................. 65
5-3. VOL Section .................................. 66
5-4. MIC Section .................................. 67
5-5. Rear Panel Section ............................. 68
Sony Pcm D50 Manual Pdf
ELECTRICAL PARTS LIST
Sony Pcm-d50 Software Mac Pro
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